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Nickel Silver stripC75400/C75200/C77000 Copper Nickel alloy

Mar 16, 2017

Basic Info.

Model NO.:C75200Product Type:Strip
Material:FeMnCarbon Content:Low Carbon
PCD:100mmET:15mm
Hole:5Package:500m/Spool
Specification:0.01-3mm*0.3-600mmTrademark:TANKII
Origin:Shanghai, ChinaSize:T:0.01-5mm
surface:brightstandard:GB/ASTM/JIS/BIS/DIN
HS Code:7409400000Production Capacity:100ton/Year

Product Description

 Nickel Silver strip
Form: sheet / plate / strip / bar / rod
Cu-Ni-Zn alloy
Excellent corrosion resistance
good mechanical strength
 
                           Copper Nickel Zinc alloy strip nickel alloy  BZn18-18
 

 
Parameter for Nickel Silver Strips/Copper Nickel Zinc Strips:   
 

Alloy No.Chemical Composition


CuMnNiZn
 BZn18-1862.0-660-0.516.5-19.5Remainder
 BZn15-2060.0-640-0.512.5-15.5Remainder
 BZn18-2654.0-580-0.516.5-19.5Remainder
 

  
Nickel Silver 
 
CuNi18Zn20 Zinc Cupronickel Alloys
 
CuNi18Zn20) - UNS.C75200 Nickel Silver Alloys, also called Copper - Nickel - Zinc alloys, 65 - 18 - 18 respectively, 
which has good formability, good corrosion and tarnish - resistance performance, and this alloy has the pleasing 
silver - like color.
 
Available Products (forms): 
 
Strip, Plate, Wire, Round bars, Flat bars, Square bars, Rectangular bars, Hexagon bars
 
Chemical composition 

ArticlesChemical composition




GBUNSENJISCu%Ni%Zn%
18-18C75200CuNi18Zn20C752162-6616.5-19.5Rem

Physical Properties

Melting Point - Liquidus1083℃
Melting Point - Solidus1065℃
Density8.91 gm/cm3@ 20 ℃
Specific Gravity8.91
Electrical Resistivity1.71 microhm-cm @ 20 ℃
Electrical Conductivity**0.591 MegaSiemens/cm @ 20 ℃
Thermal Conductivity391.1 W/m ·oK at 20 C
Coefficient of Thermal Expansion16.9 ·10-6per℃(20-100 ℃)
Coefficient of Thermal Expansion17.3 ·10-6per℃(20-200 ℃)
Coefficient of Thermal Expansion17.6·10-6per℃(20-300 ℃)
Specific Heat Capacity393.5 J/kg ·oK at 293 K
Modulus of Elasticity in Tension117000 Mpa
Modulus of Rigidity44130 Mpa

 
Application of Copper foil
1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3)PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials